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Platforms we are built into
The same four material families serve very different thermal problems. What changes between them is which direction the heat needs to go, how flat the surfaces are, and how hot it is allowed to get.
AI servers, GPUs and accelerators
The hardest interface problem in the industry right now. Through-plane film and vertically aligned graphene at the die and lid interfaces, elastic foam where the stack-up moves, and vapor chambers where heat has to travel. Specified in place of liquid metal in liquid-cooled builds.
Data center infrastructure
Cold plate interfaces, rack-level heat spreading, and anti-corrosion coatings for the liquid loops that are now standard in high-density deployments.
5G and telecom
Rigid PGS film and graphite sheet for radio units, power amplifiers and outdoor enclosures that swing through a wide ambient range.
Power electronics
High-temperature interfaces for GaN and SiC devices, inverters and converters, where junction temperatures have moved past what legacy interface materials handle comfortably.
Automotive electronics
Interfaces built for automotive temperature range, vibration and service life, in domain controllers, ADAS compute and body electronics.
EV battery and BMS
Flexible in-plane film and soft pads for cell-to-pack heat spreading and module-level control, including the shift from modular packs to structural designs.
Smartphones, notebooks and tablets
Ultra-thin graphite and graphene film for chassis-level spreading where there is no room for anything else, and no fan to help.
Foldables and wearables
Flexible film with an intact sp² network that withstands repeated bending — the reason this material exists in a foldable at all.
AR, VR, MR and XR
Weight-sensitive spreading for head-worn devices where fan cooling is not an option and the surface a user touches has a temperature limit.
Gaming devices
Phase change materials and high-conductivity pads for sustained boost clocks rather than short bursts.
Robotics
Compact thermal solutions for actuators, edge compute and sealed enclosures with no airflow.
Defense and aerospace
High-reliability interfaces with wide operating temperature and long service-life requirements, including conduction-cooled formats.
Send us the hot spot.
We will send back material.
Tell us the power, the envelope, the mounting pressure and what you run today. We cut evaluation parts to your geometry and give your team the data to bench them against the incumbent.