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How we work with your team
We sell application-qualified components, not raw material. The value only shows up in your system, so the work is done against your thermal model and your build.
Define
You share the power map, envelope, mounting pressure, flatness, temperature limits and the incumbent material. We identify which layer is actually limiting performance.
Sample
We supply evaluation material cut to your geometry, with the property data and handling guidance your team needs to bench it against what you run today.
Integrate
Our application engineers work through bond-line thickness, compression, dispensing or placement, and assembly-line compatibility.
Qualify
Reliability and life testing against your protocol — thermal cycling, humidity, aging and the mechanical requirements for your platform.
Supply
Production release with documented specifications, change control and a volume ramp aligned to your program schedule.
What we need to start
- Power and heat map. Watts per device, hot-spot locations and duty cycle.
- Mechanical envelope. Gap, tolerance stack-up, surface flatness and mounting pressure.
- Thermal limits. Junction and case temperature targets, coolant or ambient condition.
- Incumbent material. What is specified today, and where it is falling short.
On published specifications
The capability ranges on this site are what we publish openly. Full grade-by-grade property tables, tolerances, test conditions and reliability data are provided under NDA at the sampling stage, alongside material cut to your geometry.
That is not evasion. A conductivity figure quoted without its test method is not comparable between suppliers — the same material can differ by more than half depending on whether it was measured by a guarded hot plate method or a transient one. When we give you numbers, we give you the conditions with them, and we would rather do that in a technical conversation than on a web page.
Send us the hot spot.
We will send back material.
Tell us the power, the envelope, the mounting pressure and what you run today. We cut evaluation parts to your geometry and give your team the data to bench them against the incumbent.
Questions engineers ask us
Why are full specifications not published on the site?
A thermal conductivity figure quoted without its test method is not comparable between suppliers. The same material can differ by more than half depending on whether it was measured by a guarded hot plate method or a transient one. We publish capability ranges openly and give full property tables with their test conditions under NDA, where the numbers arrive with context.
What is the difference between thermal conductivity and thermal impedance?
Conductivity describes the material in isolation. Impedance, in degrees Celsius per square centimetre per watt, describes what the assembled interface actually delivers, including the contact resistance at both faces. For a through-plane material, impedance is the number that predicts system performance.
How long does qualification usually take?
It depends entirely on your protocol. Sampling and bench evaluation typically move in weeks. Formal qualification with thermal cycling, humidity and aging is set by your requirements, and automotive and defense programs run considerably longer than data center hardware.
Can you supply material cut to our geometry?
Yes. Evaluation parts are cut to your drawing, and production supply includes die-cut geometries, laminations and adhesive backings to print.
Do you sell raw material or finished parts?
Both, but we work as an application-qualified component supplier rather than a material vendor. The value only appears in your system, so the engineering work is done against your stack-up.
What information do you need to give a useful first answer?
Power per device and hot-spot locations, the mechanical envelope including gap and tolerance stack-up, surface flatness and mounting pressure, junction and case temperature targets, and what material is specified today.